22 11.08 d wima smd-pps metallized polyphenylene-sulphide (pps) smd film capacitors with box encapsulation special features electrical data ? size codes 1812, 2220, 2824, 4030,5040 and 6054 with pps and encapsulated ? operating temperature up to 140 c ? self-healing ? suitable for lead-free soldering ? low dissipation factor ? low dielectric absorption ? very constant capacitance value versus temperature ? according to rohs 2002/95/ec typical applications for general applications in high temperature circuits e.g. ? by-pass ? blocking ? coupling and decoupling ? timing ? filtering ? oscillating circuits construction dielectric: polyphenylene-sulphide (pps) film capacitor electrodes: vacuum-deposited internal construction: plastic film v acuum- deposited electrod e metal contact layer (schoopage) t erminating plate encapsulation: solvent-resistant, flame-retardant plastic case, ul 94 v-0 terminations: tinned plates. marking: colour: black. capacitance range: 0.01 m f to 6.8 m f rated voltages: 63 vdc, 100 vdc, 250 vdc, 400 vdc, 630 vdc, 1000 vdc capacitance tolerances: 20%, 10% (5% available subject to special enquiry) operating temperature range: C55 ) c to +140 ) c climatic test category: 55/140/56 in accordance with iec insulation resistance at +20 + c: u r u test c ? 0.33 m f 0.33 m f < c ? 6.8 m f 63 vdc 50 v ? 1 x 10 4 m ? ? 3000 sec (m ? x m f) 100 vdc 100 v (mean value: 3 x 10 4 m ? ) (mean value: 6000 sec) ? 250 vdc 100 v ? 3 x 10 4 m ? ? 6000 sec (m ? x m f) (mean value: 6 x 10 4 m ? ) (mean value: 12 000 sec) measuring time: 1 min. dissipation factors at +20 ) c: tan d at f c ? 0.1 m f 0.1 m f < c ? 1.0 m f c > 1.0 m f 1 khz ? 15 x 10 -4 ? 20 x 10 -4 ? 20 x 10 -4 10 khz ? 20 x 10 -4 ? 25 x 10 -4 C 100 khz ? 50 x 10 -4 C C maximum pulse rise time: for pulses equal to the rated voltage capacitance pulse rise time v/ m sec m f max. operation/test 63 vdc 100 vdc 250 vdc 400 vdc 630 vdc 1000 vdc 0.01 ... 0.022 25/250 25/250 30/300 35/350 40/400 45/450 0.033 ... 0.068 15/150 15/150 20/200 25/250 28/280 32/320 0.1 ... 0.22 10/100 10/100 12/120 15/150 18/180 C 0.33 ... 0.68 5/50 5/50 6/60 8/80 C C 1.0 ... 2.2 3/30 3/30 4/40 C C C 3.3 ... 6.8 2/20 C C C C C test voltage: 1.6 u r , 2 sec. voltage derating: for dc and ac voltages a voltage derating factor of 1% per k must be applied from +100 + c and of 2% per k from +125 + c. reliability: operational life ? 300 000 hours failure rate ? 2 fit (0.5 x u r and 40 + c) dip solder test/processing resistance to soldering heat: test tb in accordance with din iec 60068-2-58/din en 60384-20. soldering bath temperature max. 260 + c. soldering duration max. 5 sec. change in capacitance d c/c ? 5 %. soldering process: wave soldering and re-flow soldering (see temperature/time graphs page 14). packing available taped and reeled in 12 mm blister pack. detailed taping information and graphs at the end of the catalogue. for further details and graphs please refer to technical information.
23 11.08 continuation general data d 63 vdc/40 vac* 100 vdc/63 vac* 250 vdc/160 vac* 400 vdc/200 vac* 630 vdc/300 vac* 1000 vdc/400 vac* capacitance size code h size code h size code h size code h size code h size code h 0.3 0.3 0.3 0.3 0.3 0.3 0.01 m f 1812 3.0 1812 3.0 2220 3.5 2824 3.0 5040 6.0 5040 6.0 2220 3.5 2220 3.5 0.015 ? 1812 3.0 1812 3.0 2220 3.5 2824 5.0 5040 6.0 5040 6.0 2220 3.5 2220 3.5 0.022 ? 1812 3.0 1812 3.0 2220 3.5 4030 5.0 5040 6.0 5040 6.0 2220 3.5 2220 3.5 2824 3.0 5040 6.0 0.033 ? 1812 3.0 1812 3.0 2824 3.0 4030 5.0 5040 6.0 6054 7.0 2220 3.5 2220 3.5 4030 5.0 5040 6.0 2824 3.0 2824 3.0 0.047 ? 1812 3.0 1812 3.0 2824 5.0 4030 5.0 5040 6.0 6054 7.0 2220 3.5 2220 3.5 4030 5.0 5040 6.0 2824 3.0 2824 3.0 0.068 ? 1812 3.0 2220 3.5 2824 5.0 4030 5.0 6054 7.0 2220 3.5 2824 3.0 4030 5.0 5040 6.0 2824 3.0 0.1 m f 1812 3.0 2220 3.5 2824 5.0 4030 5.0 6054 7.0 2220 3.5 2824 3.0 4030 5.0 5040 6.0 2824 3.0 5040 6.0 6054 7.0 0.15 ? 1812 3.0 2220 3.5 4030 5.0 4030 5.0 6054 7.0 2220 3.5 2824 3.0 5040 6.0 5040 6.0 2824 3.0 6054 7.0 6054 7.0 0.22 ? 1812 4.0 2220 4.5 4030 5.0 5040 6.0 2220 4.5 2824 5.0 5040 6.0 6054 7.0 2824 5.0 6054 7.0 0.33 ? 2220 4.5 2824 5.0 4030 5.0 5040 6.0 2824 5.0 4030 5.0 5040 6.0 6054 7.0 4030 5.0 6054 7.0 0.47 ? 2220 4.5 2824 5.0 4030 5.0 6054 7.0 2824 5.0 4030 5.0 5040 6.0 4030 5.0 6054 7.0 0.68 ? 2824 5.0 4030 5.0 5040 6.0 4030 5.0 6054 7.0 1.0 m f 2824 5.0 5040 6.0 6054 7.0 4030 5.0 5040 6.0 1.5 ? 4030 5.0 6054 7.0 6054 7.0 5040 6.0 2.2 ? 5040 6.0 6054 7.0 6054 7.0 3.3 ? 5040 6.0 6054 7.0 4.7 ? 6054 7.0 6.8 ? 6054 7.0 * ac voltages: f ? 400 hz; 1.4 x u rms + udc ? u r new values and ranges. taped version see page 120. rights reserved to amend design data without prior notification. wima smd-pps solder pad recommendation dims. in mm. size l w d a b c code 0.3 0.3 min. min. max. 1812 4.8 3.3 0.5 1.2 3.5 3.5 2220 5.7 5.1 0.5 1.2 4 4.5 2824 7.2 6.1 0.5 1.2 4 6.5 4030 10.2 7.6 0.5 2.5 6 9 5040 12.7 10.2 0.7 2.5 6 11.5 6054 15.3 13.7 0.7 2.5 6 14 h w l d d b c a bonding slit
14 11.08 d recommendation for processing and application of smd capacitors layout form the components can generally be positioned on the carrier material as desired. in order to prevent soldering shadows or ensure regular temperature distribution, extreme concentration of the components should be avoided. in practice, it has proven best to keep a minimum distance of the soldering surfaces between two wima smds of twice the height of the components. solder pad recommendation h w l d d b c a bonding slit size code l 0.3 w 0.3 d a min. b min. c max. 1812 4.8 3.3 0.5 1.2 3.5 3.5 2220 5.7 5.1 0.5 1.2 4 4.5 2824 7.2 6.1 0.5 1.2 4 6.5 4030 10.2 7.6 0.5 2.5 6 9 5040 12.7 10.2 0.7 2.5 6 11.5 6054 15.3 13.7 0.7 2.5 6 14 the solder pad size recommendations given for each individual series are to be understood as minimum dimensions which can at any time be adjusted to the layout form. processing the processing of smd components C assembling C soldering C washing C electrical final inspection/ calibrating must be regarded as a complete process. the soldering of the printed circuit board, for example, can constitute considerable stress on all the electronic components. the manufacturers instructions on the pro - cessing of the components are mandatory. due to the diverse procedures and the varying heat requirements of the different types of components, an exact processing temperature for re-flow soldering processes cannot be specified. the graph shows the upper limits of temperature and time which must not be exceeded when establishing the solder profile according to your actual requirements. a max. temperature of t = 210 c inside the component should not be exceeded when processing wima smd capacitors. soldering process wima smd capacitors with plastic film dielectric are generally suitable for hand- soldering with a soldering iron where, however, similar to automated soldering processes, a certain duration and tempera - ture should not be exceeded. these para - meters are dependent on the physical size of the components and the relevant heat absorption involved. the below data are to be regarded as guideline values and should serve to avoid damage to the dielectric caused by exces - sive heat during the soldering process. the soldering quality depends on the tool used and on the skill and experience of the per - son with the soldering iron in hand. smd handsoldering size code temperature c / f time duration 1812 225 / 437 2 sec plate 1 / 5 sec off / 2 sec plate 2 2220 225 / 437 3 sec plate 1 / 5 sec off / 3 sec plate 2 2824 250 / 482 3 sec plate 1 / 5 sec off / 3 sec plate 2 4030 260 / 500 5 sec plate 1 / 5 sec off / 5 sec plate 2 5040 260 / 500 5 sec plate 1 / 5 sec off / 5 sec plate 2 6054 260 / 500 5 sec plate 1 / 5 sec off / 5 sec plate 2 re-flow soldering temperature/time graph for the permissible processing temperature of the wima smd film capacitor for typical convection soldering processes.
15 d solder paste to obtain the best soldering performance we suggest the use of following solder paste alloy: lead free solder paste sn - bi sn - zn (bi) sn - ag - cu solder paste with lead sn - pb - ag (sn60-pb40-a, sn63-pb37-a) washing basically, all plastic encapsuled compon- ents, irrespective of the brand cannot be considered as being hermetically sealed. they are therefore only suitable for industrial washing processes to a limited extent. during the washing process, washing agents can penetrate the interio r of the component by capillary action through microcracks which might have occured. this is dependent on a number of parameters e.g - washing agents - viscosity of the washing solvent - temperature/time of the washing process - mechanical washing aids such as ultrasonic water pressure rinsing and spraying pressure the type of washing agent to be used is largely specific to the individual user or is often laid down by the manufacturer of the washing equipment. the agressiveness of the washing agent to be used can thus only be judged in appropriate test series relating to each individual washing pro - cess. by and large, the basic rule is that the washing process should be carried out as gently as possible. drying during the washing process, aqueous solutions can penetrate the component. this can lead to changes in the electrical parameters. suitable drying measures should ensure that no residual moisture or traces of washing substances are left in the component. initial operation/calibration due to the stress which the components are subjected to during processing, rever - sible parameter changes occur in almost all electronic components. the capaci - tance recovery accuracy to be expected with careful processing is within a scope of ? d c/c ? 5 %. for the initial operation of the device a minimum storage time of t 6 24 hours is to be taken into account. with cali- brated devices or when the application is largely dependent on capacitance it is advisable to prolong the storage time to t 6 10 days in this way ageing effects of the capacitor structure can be anticipated. parameter changes due to processing are not to be expected after this period of time humidity protection bags taped wima smd capacitors are shipped in humidity protection bags according to jedec standard, level 1 (emi/static-shielding bags conforming to mil-b 81705, type 1, class 1). under controlled conditions the components can be stored two years and more in the originally sealed bag. opened packing units should be consumed instantly or resealed for specific storage under controlled conditions. reliability taking account of the manufacturers guidelines and compatible processing, the wima smd stand out for the same high quality and reliability as the analogous through-hole wima series. the technology of metallized film capacitors used e.g. in wima smd-pet achieves the best values for all fields of application. the expected value is about: 0 5 2 fit furthermore the production of all wima components is subject to the regulations laid down by iso 9001:2000 as well as the guidelines for component specifications set out by iec quality assessment system (iecq-cecc) for electronic components. electrical characteristics and fields of application basically the wima smd series have the same electrical characteristics as the ana - logous through-hole wima capacitors. compared to ceramic or tantalum dielectrics wima smd capacitors have a number of other outstanding qualities : favourable pulse rise time low esr low dielectric absorption available in high voltage series large capacitance spectrum stand up to high mechanical stress good long-term stability as regards technical performance as well as quality and reliability, the wima smd series offer the possibility to cover nearly all applications of conventionally through- hole film capacitors with smd components. furthermore, the wima smd series can now be used for all the demanding capacitor applications for which, in the past, the use of through-hole components was mandatory: measuring techniques oscillator circuits differentiating and integrating circuits a/d or d/a transformers sample and hold circuits automotive electronics with the wima smd programme avai - lable today, the major part of all plastic film capacitors can be replaced by wima smd components. the field of application ranges from standard coupling capacitors to use in switch-mode power supplies as filter or charging capacitors with high vol - tage and capacitance values, as well as in telecommunications e.g. the well-known telephone capacitor 1 m f/250vdc. 11.08
120 11.08 d 13 0. 5 n 1 .5 180/330 +0 - 2 +2 - 0 w 1 w max . 2 p 2 w 0 t f k d 0 d 1 p 0 b 0 b 1 w e g a 0 a 1 p 10 - 2 0 e mpty compartments 10 - 2 0 e mpty compartments min. 200 mm t ape return t ape advanc e unwinding directio n cover film advanc e smd 1812 a 0 0.1 a 1 b 0 0.1 b 1 d 0 + 0.1 -0 d 1 + 0.1 -0 p 0.1 p 0 * 0.1 p 2 0.05 e 0.1 f 0.05 g w 0.3 w 0 0.2 k 0.1 t 0.1 taped reel 180 mm p taped reel 330 mm p bulk box size 4.8x 3.3x 3 3.55 3.3 5.1 4.8 p 1.5 p 1.5 8 4 2 1.75 5.5 2.2 12 9.5 3.4 0.3 750 2500 1000 4.8x 3.3x 4 3.55 3.3 5.1 4.8 p 1.5 p 1.5 8 4 2 1.75 5.5 2.2 12 9.5 4.4 0.3 500 2000 1000 smd 2220 a 0 0.1 a 1 b 0 0.1 b 1 d 0 + 0.1 -0 d 1 + 0.1 -0 p 0.1 p 0 * 0.1 p 2 0.05 e 0.1 f 0.05 g w 0.3 w 0 0.2 k 0.1 t 0.1 taped reel 180 mm p taped reel 330 mm p bulk box size 5.7x 5.1x 3.5 6.3 5.7 5.6 5.1 p 1.5 p 1.5 8 4 2 1.75 5.5 1.95 12 9.5 3.7 0.3 500 1800 1000 5.7x 5.1x 4.5 6.3 5.7 5.6 5.1 p 1.5 p 1.5 8 4 2 1.75 5.5 1.95 12 9.5 4.7 0.3 400 1500 1000 smd 2824 a 0 0.1 a 1 b 0 0.1 b 1 d 0 + 0.1 -0 d 1 + 0.1 -0 p 0.1 p 0 * 0.1 p 2 0.05 e 0.1 f 0.05 g w 0.3 w 0 0.2 k 0.1 t 0.1 taped reel 330 mm p bulk box size 7.2x 6.1x 3 6.6 6.1 7.7 7.2 p 1.5 p 1.5 12 4 2 1.75 5.5 0.9 12 9.5 3.4 0.3 1500 1000 7.2x 6.1x 5 6.6 6.1 7.7 7.2 p 1.5 p 1.5 12 4 2 1.75 5.5 0.9 12 9.5 5.4 0.4 750 1000 a 0 0.1 a 1 b 0 0.1 b 1 d 0 + 0.1 -0 d 1 + 0.1 -0 p 0.1 p 0 * 0.1 p 2 0.05 e 0.1 f 0.05 g w 0.3 w 0 0.2 k 0.1 t 0.1 taped reel 330 mm p bulk smd 4030 10.7 10.2 9.7 9.1 p 1.5 p 1.5 16 4 2 1.75 7.5 1.9 16 13.3 5.9 0.3 775 500 smd 5040 13.2 12.7 12.1 11.5 p 1.5 p 1.5 16 4 2 1.75 11.5 4.7 24 21.3 7.0 0.3 600 200 smd 6054 17.0 16.5 15.6 15.0 p 1.5 p 1.5 20 4 2 1.75 11.5 2.95 24 21.3 7.5 0.3 450 200 * cumulative after 10 steps p 0.2 mm max. samples and pre-production needs on request or 1 reel minimum. all dims. in mm. type w 2max w 1 2 0 n 1.5 1812 19 12.4 62 2220 19 12.4 62 2824 19 12.4 62 4030 22.4 16.4 60 5040 30.4 24.4 90 6054 30.4 24.4 90 packing units tape reel: tape advance and return: blister tape packaging and packing units of the wima smd capacitors
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